BA604 thermal characteristics parameter test condition symbol value unit peak reverse voltage, non repetitive v rsm 80 v reverse voltage v r 50 v peak forward surge current t p = 1 s i fsm 2a repetitive peak forward current i frm 450 ma forward continuous current i f 200 ma power dissipation p v 500 mw parameter test condition symbol value unit thermal resistance junction to ambient air on pc board 50 mm x 50 mm x 1.6 mm r thja 500 k/w junction lead t l = constant r thjl 350 k/w junction temperature t j 175 c storage temperature range t stg - 55 to + 175 c features maximum ratings @ t a = 25c unless otherwise specified @ t a = 25c unless otherwise specified silicon planar diode ! electrical characteristics parameter test condition symbol min ty p. max unit forward voltage i f = 50 ma v f 1100 mv reverse current v r = 50 v i r 1a v r = 20 v i r 50 na v r = 20 v, t j = 150 c i r 50 a breakdown voltage i r = 100 a v (br) 80 v reverse recovery time i f = 10 ma, i r = 10 ma, i r = 1 ma t rr 20 ns diode capacitance v r = 0, f = 1 mhz c d 4pf @ t a = 25c unless otherwise specified surface mount fast switching diode case: sod-80/ll34, glass terminals: solderable per mil-std-202, method 208 polarity: cathode band weight: 0.05 grams (approx.) mechanical data ! ! ! ! ! ll34/ sod-80 a c b dim min max a 3.30 3.70 b 1.30 1.60 c 0.28 0.50 all dimensions in mm
|
